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Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. -- Wikipedia

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Field-programmable gate array - Wikipedia

FPGAs are also commonly used during the development of ASICs to speed up the simulation process.
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Printable Electronics Products | Dycotec Materials

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Windscreen Chip Repair Melbourne | Mobile Chip replacement Service | C

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Chip Level Laptop Service Center Near Me Chennai

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