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Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. -- Wikipedia

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Field-programmable gate array - Wikipedia

FPGAs are also commonly used during the development of ASICs to speed up the simulation process.
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Printable Electronics Products | Dycotec Materials

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PPT - How to Boost Your Software Quality with Efficient Parallel Testi

Parallel Testing boosts software quality with fast, reliable results. Learn how to streamline API testing, reduce errors, and accelerate releases with efficient testing. Visit: https://www.karatelabs.io/api-testing Slid
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Windscreen Chip Repair Melbourne | Mobile Chip replacement Service | C

Looking for a car windscreen chip repair or replacement service in Melbourne, contact Cheap Windscreens Melbourne! We offer quality chip repair solutions at best price.
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Windscreen Stone Chip Repair London | Car Glass Service

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